| AA |
Antenna Array |
| AA |
Automatic Acknowledge |
| ABS |
Acrylonitrile-Butadiene-Styrene(Plastic) |
| AC |
All Call |
| AC |
Alternating Current |
| ACA |
Anisotropically Conductive Adhesive |
| ACC |
Advanced Concept Construction Active Control Channel |
| ACCU |
Alternating Current Connection Unit |
| AEC |
Architecture, Engineering And Construction |
| Agc |
Automatic Gain Control |
| AGR |
Annual Average Growth Rate |
| AGV |
Automated Guided Vehicle |
| AI |
Artificial Intelligence |
| AIS |
Adhesive Interconnect System |
| ANOVA |
Analysis Of Variance |
| ANSI |
American National Standards Institute |
| AOI |
Automated Optical Inspection |
| AOQ |
Average Outgoing Quality |
| APT |
Automatically Programmed Tools |
| AQL |
Acceptable Quality Level |
| ARINC |
Aeronautical Radio Incorporated |
| ASCII |
American Standard Code For Information Interchange |
| ASIC |
Application Specific Integrated Circuit |
| ASME |
American Society Of Mechanical Engineers |
| ASPaRC |
Ability Of Solder Paste To Retain Components |
| ASQ |
American Society For Quality |
| ASTM |
American Society For Testing And Materials |
| ATE |
Automatic Test Equipment |
| ATG |
Automatic Test Generation |
| ATR |
Air Transport Rack |
| AVT |
Accelerated Vesication Test |
| AWG |
American Wire Gauge |
| AXI |
Automated X-Ray Inspection |
| BC |
Buried Capacitance |
| BDMA |
Benzyldimethylamine |
| BGA |
Ball Grid Array |
| BITE |
Built-In Test Equipment |
| BOD |
Biochemical Oxygen Demand |
| BOM |
Bill Of Material |
| BOT |
Build To Order |
| BT |
Bismaleimide Triazine |
| BTAB |
Bumped Tape-Automated Bonding |
| C&E |
Cause And Effect |
| C3 |
Command,Control And Communicate |
| C4 |
Controlled Collapse Component Connection |
| CAD |
Computer-Aided Design |
| CAE |
Computer-Aided Engineering |
| CAF |
Cathotic Anionic Filaments |
| CAFM |
Computer-Aided Facilities Management |
| CAGE |
Commercial And Government Entity |
| CALS |
Computer-Aided Acquisition And Logistic Support(DOD) |
| CAM |
Computer-Aided Manufacturing |
| CAPP |
Computer-Aided Process Planning |
| CAR |
Computer-Aided Repair |
| CASE |
Computer-Aided Software Engineering |
| CAT |
Computer-Aided Testing |
| CBGA |
Ceramic Ball Grid Array |
| CCAPS |
Circuit Card Assembly And Processing System |
| CDA |
Copper Development Association |
| CEPM |
Certified Ems Program Managers |
| CET |
Certified Electronic Technician |
| CFM |
Continuous Flow Manufacturing |
| CFM |
Cubic Feet Per Minute |
| CIM |
Computer-Integrated Manufacturing |
| CISC |
Complex Instruction Set Computing |
| CITIS |
Contractor Integrated Technical Information Services |
| CM |
Contract Manufacturer |
| CMC |
Copper Moly Copper |
| CMOS |
Complimentary Metal-Oxide Semiconductor |
| CNC |
Computer Numerical Control |
| COB |
Chip-On-Board |
| COD |
Consumed Oxygen Demand |
| COT |
Configure To Order |
| Cp |
Capability Performance |
| CPL |
Capability Performance, Lower |
| CPLD |
Complex Programmable Logic Device |
| CPU |
Capability Performance, Upper |
| CPU |
Central Processing Unit(Computer) |
| CRC |
Cyclic Redundancy Check |
| CRT |
Cathode-Ray Tube |
| CSA |
Canadian Standards Agency |
| CSG |
Constructive Solids Geometry |
| CSP |
Chip Scale Package |
| CTE |
Coefficient Of Thermal Expansion |
| CVS |
Cyclic Voltammetry Stripping |
| DAB |
Designated Audit Body |
| DATC |
Design Automation Technical Committee (Ieee) |
| DBMS |
Database Management System |
| DC |
Direct Current |
| DCAS |
Defense Contract Administration Service |
| DCMA |
Defense Contract Management Agency |
| DCMC |
Defense Contract Management Command |
| DESC |
Defense Electronics Supply Center |
| DFM |
Design For Manufacture |
| DIM |
Data-Information Record |
| DIN |
Deutsches Institute For Normung |
| DIP |
Dual-Inline Package |
| Dk |
Dielectric Constant |
| DLA |
Defense Logistics Agency (Dod) |
| DMA |
Direct Memory Access |
| DMS |
Dynamic Mechanical Spectroscopy |
| DMSA |
Defense Manufacturers And Suppliers Association |
| DNC |
Distributed (Or Direct) Numerical Control |
| DOD |
Department Of Defense |
| DOD |
Dissolved Oxygen Demand |
| DOE |
Design Of Experiments |
| DOS |
Disc Operating System |
| DRC |
Design Rule Checking |
| DRM |
Drawing Requirements Manual |
| DS |
Double-Sided |
| DSC |
Differential Scanning Calorimetry |
| DSP |
Digital Signal Processor |
| DTP |
Diameter True Position |
| DTS |
Dock To Stock |
| DVM |
Digital Voltmeter |
| DXF |
Data Exchange Format |
| ECAD |
Electronic Computer-Aided Design |
| ECC |
Error Correction Code |
| ECCB |
Electronic Components Certification Board |
| ECL |
Emitter-Coupled Logic |
| ECM |
Electronic Countermeasures |
| ECN |
Engineering Change Notice |
| ECO |
Engineering Change Order |
| ECR |
Engineering Change Request |
| ED |
Electrodeposited |
| EDA |
Electronic Design Automation |
| EDI |
Electronic Data Interchange |
| EDIF |
Electronic Design Interchange Format |
| EDM |
Electro-Discharge Machining |
| EDO |
Extended Data Out |
| EIA |
Electronics Industry Association |
| EIS |
Engineering Information System |
| ELD |
Electro-Luminescent Diode |
| EMC |
Electromagnetic Compatibility |
| EMF |
Electro-Motive Force |
| EMI |
Electromagnetic Interference |
| EMP |
Electromagnetic Pulse |
| EMPF |
Electronics Manufacturing Productivity Facility |
| EMS |
Electrical Manufacturing Services |
| EPA |
Environmental Protection Agency |
| EPR |
Ethylene-Propylene (Copolymer) Resin |
| EPT |
Ethylene-Propylene Terepolymer |
| ESD |
Electrostatic Discharge |
| ESI |
Early Supplier Involvement |
| ESR |
Equivalent Series Resistance |
| ETPC |
Electrolytic Tough-Pitch Copper |
| FAA |
Federal Aviation Administration |
| FAR |
Failure Analysis Report |
| FCC |
Federal Communications Commission |
| FCC |
Flat-Conductor Cable |
| FC-CBGA |
Flip Chip Ceramic Ball Grid Array |
| FC-PBGA |
Flip Chip Platic Ball Grid Array |
| FCT |
Functional Circuit Test |
| FEA |
Finite-Element Analysis |
| FEM |
Finite-Element Modeling |
| FEP |
Fluorinated Ethylene-Propylene (Teflon) |
| FET |
Field-Effect Transistor |
| FFT |
Fast Fourier Transform |
| FMEA |
Fault Mode And Effect Analysis |
| FPGA |
Field Programmable Gate Array |
| FPT |
Fine-Pitch Technology |
| FSCM |
Federal Stock Code For Manufacturers |
| FTP |
File Transfer Protocol |
| GaAs |
Gallium Arsenide |
| GBIB |
General Purpose Interface Bus |
| GMA |
Gas Metal Arc (Welding) |
| GTA |
Gas Tungsten Arc (Welding) |
| GTPBGA |
Glob Top Plastic Ball Grid Array |
| HASL |
Hot Air Solder Level |
| HPGL |
Hewlett Packard Graphic Language |
| HTE |
High Temperature Elongation |
| HTML |
Hypertext Markup Language |
| HTTP |
Hypertext Transfer Protocol |
| I/O |
Input/Output (Terminations) |
| IC |
Integrated Circuit |
| ICA |
Isotropically Conductive Adhesive |
| ICAM |
Integrated Computer-Aided Manufacturing |
| ICT |
Inner Circuit Test |
| IDC |
Insulation-Displacement Connection |
| IEC |
International Electrotechnical Commission |
| IECQ |
International Electronic Component Qualification System |
| IEDR |
Initial Engineering Design Review |
| IEEE |
Institute Of Electrical And Electronic Engineers |
| IEPS |
International Electronic Packaging Society |
| IGES |
Integrated Graphics Exchange System |
| ILB |
Inner-Lead Bonding (Tab) |
| IP |
Internet Protocol |
| IPM |
Inches Per Minute |
| IR |
Infrared |
| ISCET |
International Society Of Certified Electronics Technician |
| ISHM |
International Society For Hybrid Microelectronics |
| ISO |
International Organization For Standardization |
| ITT |
Inter-Test Time |
| JEDEC |
Solid State Technology Association (Formerly The Joint Electronic Device Engineering Council) |
| JIT |
Just-In-Time (Manufacturing) |
| KGB |
Known Good Board |
| KGD |
Known Good Die |
| LAN |
Local Area Network |
| LBA |
Logical Block Address |
| LCCC |
Leadless Ceramic Chip Carrier |
| LCD |
Liquid Crystal Display |
| LDA |
Logic Design Automation |
| LED |
Light-Emitting Diode |
| LGA |
Lang Grid Array |
| LIF |
Low Insertion Force |
| LMC |
Least Material Condition |
| LPISM |
Liquid Photo-Imageable Solder Mask |
| LRU |
Lowest Replaceable Unit |
| LSI |
Large Scale Integration (Integrated Circuit) |
| LTCC |
Low Temperature Co-Fired Ceramic |
| MA |
Mechanical Advantage |
| MAC |
Maximum Allowable Concentration |
| MAC |
Media Access Control |
| MAP |
Manufacturing Automation Protocol |
| MATS |
Material Transport Segment |
| MCAD |
Mechanical Computer Aided Design |
| MCAE |
Mechanical Computer-Aided Engineering |
| MCM |
Multichip Module |
| MDA |
Methylenedianiline |
| MEK |
Methyl-Ethyl Ketone |
| MELF |
Metal Electrode Face (Discrete Leadless Component) |
| MIBK |
Methyl-Isobutyl Ketone |
| MIR |
Moisture Insulation Resistance |
| MITI |
Ministry Of International Trade And Industry (Japan) |
| MLB |
Multilayer Board |
| MLPWB |
Multilayer Printed Wiring Board |
| MMC |
Maximum Material Condition |
| MMIC |
Monolithic Microwave Integrated Circuit |
| MOS |
Metal-Oxide Semiconductor |
| MRP |
Material Requirement Planning |
| MRP II |
Manufacturing Resource Planning |
| MSDS |
Material Safety Data Sheets |
| MSI |
Medium Scale Integration (Integrated Circuit) |
| MTBF |
Mean Time Between Failures |
| MTTR |
Mean Time To Repair |
| NADCAP |
National Aerospace And Defense Contractors Accreditation Procedures |
| NASA |
National Aeronautics And Space Administration |
| NBR |
Nitrile Butadiene-Acrylonitrile Rubber |
| NBS |
National Bureau Of Standards |
| NC |
Numerical Control |
| NDT |
Non-Destructive Testing |
| NECQ |
National Electronics Component Qualification System |
| NEMA |
National Electrical Manufacturers Association |
| NIST |
National Institute For Science And Technology |
| NMR |
Normal-Mode Rejection |
| NPI |
New Product Introduction |
| NSA |
National Security Agency |
| OA |
Organic Acid (Flux) |
| ODR |
Oscillating Disk Rheometer |
| OEM |
Original Equipment Manufacturer |
| OFHC |
Oxygen-Free High-Conductivity Copper |
| OLB |
Outer-Lead Bonding (Tab) |
| OSHA |
Occupational Safety Hazards Act |
| OSI |
Open Systems Interconnection |
| OSP |
Organic Solder Preservative |
| P&IA |
Packaging And Interconnecting Assembly |
| P&IS |
Packaging And Interconnecting Structure |
| PBGA |
Plastic Ball Grid Array |
| PB |
Printed Board |
| PBX |
Private Branch Exchange |
| PC |
Personal Computer |
| PCA |
Printed Circuit Assembly |
| PCB |
Printed Circuit Board |
| PCMCIA |
Personal Computer Memory Card International Assoc |
| PDES |
Product Data Exchange Specification |
| PDL |
Page Description Language |
| PEM |
Plastic Electronic Module |
| PGA |
Pin Grid Array (Leaded Component Package) |
| PHIGS |
Programmer’s Hierarchical Interface Graphics Standard |
| PID |
Photo-Imageable Dielectric |
| PIP |
Pin-In-Paste Technology |
| PLCC |
Plastic Leaded Chip Carrier |
| PLD |
Programmable Logic Device |
| Pp |
Process Performance (See Also Cp) |
| PPM |
Parts Per Million |
| PPO |
Polyphenylene Oxide |
| PPS |
Polyphenylene Sulfide (Plastic) |
| PRT |
Planar Resistor Technology |
| PSI |
Pounds Per Square Inch |
| PT |
Positional Tolerance |
| PTFE |
Polytetrafluoroethylene (Teflon) |
| PTH |
Plated-Through Hole |
| PVC |
Polyvinyl Chloride |
| PVT |
Production Validation Test |
| PWA |
Printed Wiring Assembly |
| PWB |
Printed Wiring Board |
| QFP |
Quad Flatpack |
| QML |
Qualified Manufacturers List |
| QPL |
Qualified Products List |
| QTA |
Quick Turn Around |
| R |
Rosin (Flux) |
| R&R |
Repeatability And Reproducibility |
| RA |
Rosin Activated (Flux) |
| RAM |
Random Access Memory |
| RETMA |
Radio Electronics & Television Manufacturers Association |
| RFI |
Radio-Frequency Interference |
| RFP |
Request For Proposal |
| RFQ |
Request For Quote |
| RFS |
Regardless Of Feature Size |
| RISC |
Reduced Instruction Set Computing |
| RMA |
Rosin Mildy Activated (Flux) |
| RMS |
Root Mean Square |
| ROM |
Read Only Memory |
| ROM |
Rough Order Of Magnitude |
| RPM |
Revolutions Per Minute |
| RSS |
Ramp Soak Spike |
| RTS |
Ramp To Spike |
| RTV |
Room Temperature Vulcanizing |
| RwoH |
Reliability Without Hermeticity |
| SAE |
Society Of Automotive Engineers |
| SBU |
Sequential Buildup |
| SEC |
Solvent Extract Conductivity |
| SEM |
Scanning Electron Microscope |
| SEM |
Standard Electronic Module (Navy) |
| SERA |
Sequential Electrochemical Reduction Analysis |
| SFM |
Surface Feet Per Minute |
| SIP |
Single Inline Package |
| SIR |
Surface Insulation Resistance |
| SMD |
Surface Mount Device |
| SMEMA |
Surface Mount Equipment Manufacturers Association |
| SMOBC |
Solder Mask Over Bare Copper |
| SMT |
Surface Mounting Technology |
| SMTA |
Surface Mount Technology Association |
| SNA |
Systems Network Architecture |
| SOIC |
Small-Outline Integrated Circuit |
| SOS |
Silicon-On-Sapphire |
| SPC |
Statistical Process Control |
| SPICE |
Simulation Program, Integrated Circuit Emphasis |
| SQC |
Statistical Quality Control |
| SQL |
Structured Query Language |
| SSI |
Small-Scale Integration (Integrated Circuit) |
| STEP |
Standard For Exchange Of Product Model Data |
| TAB |
Tape-Automated Bonding |
| TCE |
Thermal Coefficient Of Expansion |
| TCP/IP |
Transmission Control Protocol / Internet Protocol |
| TCR |
Temperature Coefficient Of Resistance |
| TDR |
Time-Domain Reflectometry |
| TEM |
Transverse Electromagnetic Mode |
| TFA |
Tree-Based Floorplanning Algorithm |
| TFE |
Tetrafluoroethylene (Teflon) |
| Tg |
Glass Transition Temperature |
| TGA |
Thermo Gravimetric Analysis |
| THT |
Through-Hole Technology |
| TIFF |
Tagged Image File Format |
| TMA |
Thermo Mechanical Analysis |
| TO |
Transistor Outline |
| TOP |
Technical And Office Protocol |
| TP |
True Position |
| TQM |
Total Quality Management |
| T’s & C’s |
Terms And Conditions |
| TTL |
Transistor-Transistor Logic |
| UBM |
Under Bump Metallization |
| UHF |
Ultra-High Frequency |
| UL |
Underwriter’s Laboratories |
| ULSI |
Ultra-Large Scale Integration (Integrated Circuit) |
| UPH |
Unit Per Hour |
| URL |
Uniform Resource Locator |
| VAR |
Value-Added Reseller |
| VHDL |
Vhsic Hardware Description Language |
| VHF |
Very-High Frequency |
| VHSIC |
Very-High Speed Integrated Circuits |
| VLSI |
Very-Large Scale Integration (Integrated Circuit) |
| VME |
Versa-Module Electronic |
| VOC |
Volatile Organic Compound |
| VSAG |
VHDL Standardization And Analysis Group (IEEE) |
| WIP |
Work In Process |
| WSI |
Wafer-Scale Integration |
| WWW |
World Wide Web |
| WYSIWYG |
What You See Is What You Get |
| XIP |
Execute In Place |
| ZAF |
Z-Axis Adhesive Film |
| ZIF |
Zero-Insertion Force |
| ZIP |
Zigzag Inline Package |
