AA |
Antenna Array |
AA |
Automatic Acknowledge |
ABS |
Acrylonitrile-Butadiene-Styrene(Plastic) |
AC |
All Call |
AC |
Alternating Current |
ACA |
Anisotropically Conductive Adhesive |
ACC |
Advanced Concept Construction Active Control Channel |
ACCU |
Alternating Current Connection Unit |
AEC |
Architecture, Engineering And Construction |
Agc |
Automatic Gain Control |
AGR |
Annual Average Growth Rate |
AGV |
Automated Guided Vehicle |
AI |
Artificial Intelligence |
AIS |
Adhesive Interconnect System |
ANOVA |
Analysis Of Variance |
ANSI |
American National Standards Institute |
AOI |
Automated Optical Inspection |
AOQ |
Average Outgoing Quality |
APT |
Automatically Programmed Tools |
AQL |
Acceptable Quality Level |
ARINC |
Aeronautical Radio Incorporated |
ASCII |
American Standard Code For Information Interchange |
ASIC |
Application Specific Integrated Circuit |
ASME |
American Society Of Mechanical Engineers |
ASPaRC |
Ability Of Solder Paste To Retain Components |
ASQ |
American Society For Quality |
ASTM |
American Society For Testing And Materials |
ATE |
Automatic Test Equipment |
ATG |
Automatic Test Generation |
ATR |
Air Transport Rack |
AVT |
Accelerated Vesication Test |
AWG |
American Wire Gauge |
AXI |
Automated X-Ray Inspection |
BC |
Buried Capacitance |
BDMA |
Benzyldimethylamine |
BGA |
Ball Grid Array |
BITE |
Built-In Test Equipment |
BOD |
Biochemical Oxygen Demand |
BOM |
Bill Of Material |
BOT |
Build To Order |
BT |
Bismaleimide Triazine |
BTAB |
Bumped Tape-Automated Bonding |
C&E |
Cause And Effect |
C3 |
Command,Control And Communicate |
C4 |
Controlled Collapse Component Connection |
CAD |
Computer-Aided Design |
CAE |
Computer-Aided Engineering |
CAF |
Cathotic Anionic Filaments |
CAFM |
Computer-Aided Facilities Management |
CAGE |
Commercial And Government Entity |
CALS |
Computer-Aided Acquisition And Logistic Support(DOD) |
CAM |
Computer-Aided Manufacturing |
CAPP |
Computer-Aided Process Planning |
CAR |
Computer-Aided Repair |
CASE |
Computer-Aided Software Engineering |
CAT |
Computer-Aided Testing |
CBGA |
Ceramic Ball Grid Array |
CCAPS |
Circuit Card Assembly And Processing System |
CDA |
Copper Development Association |
CEPM |
Certified Ems Program Managers |
CET |
Certified Electronic Technician |
CFM |
Continuous Flow Manufacturing |
CFM |
Cubic Feet Per Minute |
CIM |
Computer-Integrated Manufacturing |
CISC |
Complex Instruction Set Computing |
CITIS |
Contractor Integrated Technical Information Services |
CM |
Contract Manufacturer |
CMC |
Copper Moly Copper |
CMOS |
Complimentary Metal-Oxide Semiconductor |
CNC |
Computer Numerical Control |
COB |
Chip-On-Board |
COD |
Consumed Oxygen Demand |
COT |
Configure To Order |
Cp |
Capability Performance |
CPL |
Capability Performance, Lower |
CPLD |
Complex Programmable Logic Device |
CPU |
Capability Performance, Upper |
CPU |
Central Processing Unit(Computer) |
CRC |
Cyclic Redundancy Check |
CRT |
Cathode-Ray Tube |
CSA |
Canadian Standards Agency |
CSG |
Constructive Solids Geometry |
CSP |
Chip Scale Package |
CTE |
Coefficient Of Thermal Expansion |
CVS |
Cyclic Voltammetry Stripping |
DAB |
Designated Audit Body |
DATC |
Design Automation Technical Committee (Ieee) |
DBMS |
Database Management System |
DC |
Direct Current |
DCAS |
Defense Contract Administration Service |
DCMA |
Defense Contract Management Agency |
DCMC |
Defense Contract Management Command |
DESC |
Defense Electronics Supply Center |
DFM |
Design For Manufacture |
DIM |
Data-Information Record |
DIN |
Deutsches Institute For Normung |
DIP |
Dual-Inline Package |
Dk |
Dielectric Constant |
DLA |
Defense Logistics Agency (Dod) |
DMA |
Direct Memory Access |
DMS |
Dynamic Mechanical Spectroscopy |
DMSA |
Defense Manufacturers And Suppliers Association |
DNC |
Distributed (Or Direct) Numerical Control |
DOD |
Department Of Defense |
DOD |
Dissolved Oxygen Demand |
DOE |
Design Of Experiments |
DOS |
Disc Operating System |
DRC |
Design Rule Checking |
DRM |
Drawing Requirements Manual |
DS |
Double-Sided |
DSC |
Differential Scanning Calorimetry |
DSP |
Digital Signal Processor |
DTP |
Diameter True Position |
DTS |
Dock To Stock |
DVM |
Digital Voltmeter |
DXF |
Data Exchange Format |
ECAD |
Electronic Computer-Aided Design |
ECC |
Error Correction Code |
ECCB |
Electronic Components Certification Board |
ECL |
Emitter-Coupled Logic |
ECM |
Electronic Countermeasures |
ECN |
Engineering Change Notice |
ECO |
Engineering Change Order |
ECR |
Engineering Change Request |
ED |
Electrodeposited |
EDA |
Electronic Design Automation |
EDI |
Electronic Data Interchange |
EDIF |
Electronic Design Interchange Format |
EDM |
Electro-Discharge Machining |
EDO |
Extended Data Out |
EIA |
Electronics Industry Association |
EIS |
Engineering Information System |
ELD |
Electro-Luminescent Diode |
EMC |
Electromagnetic Compatibility |
EMF |
Electro-Motive Force |
EMI |
Electromagnetic Interference |
EMP |
Electromagnetic Pulse |
EMPF |
Electronics Manufacturing Productivity Facility |
EMS |
Electrical Manufacturing Services |
EPA |
Environmental Protection Agency |
EPR |
Ethylene-Propylene (Copolymer) Resin |
EPT |
Ethylene-Propylene Terepolymer |
ESD |
Electrostatic Discharge |
ESI |
Early Supplier Involvement |
ESR |
Equivalent Series Resistance |
ETPC |
Electrolytic Tough-Pitch Copper |
FAA |
Federal Aviation Administration |
FAR |
Failure Analysis Report |
FCC |
Federal Communications Commission |
FCC |
Flat-Conductor Cable |
FC-CBGA |
Flip Chip Ceramic Ball Grid Array |
FC-PBGA |
Flip Chip Platic Ball Grid Array |
FCT |
Functional Circuit Test |
FEA |
Finite-Element Analysis |
FEM |
Finite-Element Modeling |
FEP |
Fluorinated Ethylene-Propylene (Teflon) |
FET |
Field-Effect Transistor |
FFT |
Fast Fourier Transform |
FMEA |
Fault Mode And Effect Analysis |
FPGA |
Field Programmable Gate Array |
FPT |
Fine-Pitch Technology |
FSCM |
Federal Stock Code For Manufacturers |
FTP |
File Transfer Protocol |
GaAs |
Gallium Arsenide |
GBIB |
General Purpose Interface Bus |
GMA |
Gas Metal Arc (Welding) |
GTA |
Gas Tungsten Arc (Welding) |
GTPBGA |
Glob Top Plastic Ball Grid Array |
HASL |
Hot Air Solder Level |
HPGL |
Hewlett Packard Graphic Language |
HTE |
High Temperature Elongation |
HTML |
Hypertext Markup Language |
HTTP |
Hypertext Transfer Protocol |
I/O |
Input/Output (Terminations) |
IC |
Integrated Circuit |
ICA |
Isotropically Conductive Adhesive |
ICAM |
Integrated Computer-Aided Manufacturing |
ICT |
Inner Circuit Test |
IDC |
Insulation-Displacement Connection |
IEC |
International Electrotechnical Commission |
IECQ |
International Electronic Component Qualification System |
IEDR |
Initial Engineering Design Review |
IEEE |
Institute Of Electrical And Electronic Engineers |
IEPS |
International Electronic Packaging Society |
IGES |
Integrated Graphics Exchange System |
ILB |
Inner-Lead Bonding (Tab) |
IP |
Internet Protocol |
IPM |
Inches Per Minute |
IR |
Infrared |
ISCET |
International Society Of Certified Electronics Technician |
ISHM |
International Society For Hybrid Microelectronics |
ISO |
International Organization For Standardization |
ITT |
Inter-Test Time |
JEDEC |
Solid State Technology Association (Formerly The Joint Electronic Device Engineering Council) |
JIT |
Just-In-Time (Manufacturing) |
KGB |
Known Good Board |
KGD |
Known Good Die |
LAN |
Local Area Network |
LBA |
Logical Block Address |
LCCC |
Leadless Ceramic Chip Carrier |
LCD |
Liquid Crystal Display |
LDA |
Logic Design Automation |
LED |
Light-Emitting Diode |
LGA |
Lang Grid Array |
LIF |
Low Insertion Force |
LMC |
Least Material Condition |
LPISM |
Liquid Photo-Imageable Solder Mask |
LRU |
Lowest Replaceable Unit |
LSI |
Large Scale Integration (Integrated Circuit) |
LTCC |
Low Temperature Co-Fired Ceramic |
MA |
Mechanical Advantage |
MAC |
Maximum Allowable Concentration |
MAC |
Media Access Control |
MAP |
Manufacturing Automation Protocol |
MATS |
Material Transport Segment |
MCAD |
Mechanical Computer Aided Design |
MCAE |
Mechanical Computer-Aided Engineering |
MCM |
Multichip Module |
MDA |
Methylenedianiline |
MEK |
Methyl-Ethyl Ketone |
MELF |
Metal Electrode Face (Discrete Leadless Component) |
MIBK |
Methyl-Isobutyl Ketone |
MIR |
Moisture Insulation Resistance |
MITI |
Ministry Of International Trade And Industry (Japan) |
MLB |
Multilayer Board |
MLPWB |
Multilayer Printed Wiring Board |
MMC |
Maximum Material Condition |
MMIC |
Monolithic Microwave Integrated Circuit |
MOS |
Metal-Oxide Semiconductor |
MRP |
Material Requirement Planning |
MRP II |
Manufacturing Resource Planning |
MSDS |
Material Safety Data Sheets |
MSI |
Medium Scale Integration (Integrated Circuit) |
MTBF |
Mean Time Between Failures |
MTTR |
Mean Time To Repair |
NADCAP |
National Aerospace And Defense Contractors Accreditation Procedures |
NASA |
National Aeronautics And Space Administration |
NBR |
Nitrile Butadiene-Acrylonitrile Rubber |
NBS |
National Bureau Of Standards |
NC |
Numerical Control |
NDT |
Non-Destructive Testing |
NECQ |
National Electronics Component Qualification System |
NEMA |
National Electrical Manufacturers Association |
NIST |
National Institute For Science And Technology |
NMR |
Normal-Mode Rejection |
NPI |
New Product Introduction |
NSA |
National Security Agency |
OA |
Organic Acid (Flux) |
ODR |
Oscillating Disk Rheometer |
OEM |
Original Equipment Manufacturer |
OFHC |
Oxygen-Free High-Conductivity Copper |
OLB |
Outer-Lead Bonding (Tab) |
OSHA |
Occupational Safety Hazards Act |
OSI |
Open Systems Interconnection |
OSP |
Organic Solder Preservative |
P&IA |
Packaging And Interconnecting Assembly |
P&IS |
Packaging And Interconnecting Structure |
PBGA |
Plastic Ball Grid Array |
PB |
Printed Board |
PBX |
Private Branch Exchange |
PC |
Personal Computer |
PCA |
Printed Circuit Assembly |
PCB |
Printed Circuit Board |
PCMCIA |
Personal Computer Memory Card International Assoc |
PDES |
Product Data Exchange Specification |
PDL |
Page Description Language |
PEM |
Plastic Electronic Module |
PGA |
Pin Grid Array (Leaded Component Package) |
PHIGS |
Programmer’s Hierarchical Interface Graphics Standard |
PID |
Photo-Imageable Dielectric |
PIP |
Pin-In-Paste Technology |
PLCC |
Plastic Leaded Chip Carrier |
PLD |
Programmable Logic Device |
Pp |
Process Performance (See Also Cp) |
PPM |
Parts Per Million |
PPO |
Polyphenylene Oxide |
PPS |
Polyphenylene Sulfide (Plastic) |
PRT |
Planar Resistor Technology |
PSI |
Pounds Per Square Inch |
PT |
Positional Tolerance |
PTFE |
Polytetrafluoroethylene (Teflon) |
PTH |
Plated-Through Hole |
PVC |
Polyvinyl Chloride |
PVT |
Production Validation Test |
PWA |
Printed Wiring Assembly |
PWB |
Printed Wiring Board |
QFP |
Quad Flatpack |
QML |
Qualified Manufacturers List |
QPL |
Qualified Products List |
QTA |
Quick Turn Around |
R |
Rosin (Flux) |
R&R |
Repeatability And Reproducibility |
RA |
Rosin Activated (Flux) |
RAM |
Random Access Memory |
RETMA |
Radio Electronics & Television Manufacturers Association |
RFI |
Radio-Frequency Interference |
RFP |
Request For Proposal |
RFQ |
Request For Quote |
RFS |
Regardless Of Feature Size |
RISC |
Reduced Instruction Set Computing |
RMA |
Rosin Mildy Activated (Flux) |
RMS |
Root Mean Square |
ROM |
Read Only Memory |
ROM |
Rough Order Of Magnitude |
RPM |
Revolutions Per Minute |
RSS |
Ramp Soak Spike |
RTS |
Ramp To Spike |
RTV |
Room Temperature Vulcanizing |
RwoH |
Reliability Without Hermeticity |
SAE |
Society Of Automotive Engineers |
SBU |
Sequential Buildup |
SEC |
Solvent Extract Conductivity |
SEM |
Scanning Electron Microscope |
SEM |
Standard Electronic Module (Navy) |
SERA |
Sequential Electrochemical Reduction Analysis |
SFM |
Surface Feet Per Minute |
SIP |
Single Inline Package |
SIR |
Surface Insulation Resistance |
SMD |
Surface Mount Device |
SMEMA |
Surface Mount Equipment Manufacturers Association |
SMOBC |
Solder Mask Over Bare Copper |
SMT |
Surface Mounting Technology |
SMTA |
Surface Mount Technology Association |
SNA |
Systems Network Architecture |
SOIC |
Small-Outline Integrated Circuit |
SOS |
Silicon-On-Sapphire |
SPC |
Statistical Process Control |
SPICE |
Simulation Program, Integrated Circuit Emphasis |
SQC |
Statistical Quality Control |
SQL |
Structured Query Language |
SSI |
Small-Scale Integration (Integrated Circuit) |
STEP |
Standard For Exchange Of Product Model Data |
TAB |
Tape-Automated Bonding |
TCE |
Thermal Coefficient Of Expansion |
TCP/IP |
Transmission Control Protocol / Internet Protocol |
TCR |
Temperature Coefficient Of Resistance |
TDR |
Time-Domain Reflectometry |
TEM |
Transverse Electromagnetic Mode |
TFA |
Tree-Based Floorplanning Algorithm |
TFE |
Tetrafluoroethylene (Teflon) |
Tg |
Glass Transition Temperature |
TGA |
Thermo Gravimetric Analysis |
THT |
Through-Hole Technology |
TIFF |
Tagged Image File Format |
TMA |
Thermo Mechanical Analysis |
TO |
Transistor Outline |
TOP |
Technical And Office Protocol |
TP |
True Position |
TQM |
Total Quality Management |
T’s & C’s |
Terms And Conditions |
TTL |
Transistor-Transistor Logic |
UBM |
Under Bump Metallization |
UHF |
Ultra-High Frequency |
UL |
Underwriter’s Laboratories |
ULSI |
Ultra-Large Scale Integration (Integrated Circuit) |
UPH |
Unit Per Hour |
URL |
Uniform Resource Locator |
VAR |
Value-Added Reseller |
VHDL |
Vhsic Hardware Description Language |
VHF |
Very-High Frequency |
VHSIC |
Very-High Speed Integrated Circuits |
VLSI |
Very-Large Scale Integration (Integrated Circuit) |
VME |
Versa-Module Electronic |
VOC |
Volatile Organic Compound |
VSAG |
VHDL Standardization And Analysis Group (IEEE) |
WIP |
Work In Process |
WSI |
Wafer-Scale Integration |
WWW |
World Wide Web |
WYSIWYG |
What You See Is What You Get |
XIP |
Execute In Place |
ZAF |
Z-Axis Adhesive Film |
ZIF |
Zero-Insertion Force |
ZIP |
Zigzag Inline Package |