Electronics Terminology
Industry Acronyms
Enhance your technical vocabulary and break down language barriers with our all-encompassing electronics terminology of industry acronyms. Effortlessly navigate the dynamic landscape of electronics terminology. Achieve clear and impactful communication with our indispensable resources. Stay ahead in the fast-paced world of electronics and deepen your understanding with our extensive glossary. This listing will equip you with the essential terminology to thrive in the industry. Stay updated on the latest trends, innovations, and developments in electronics.
| A | Antenna Array |
| AA | Automatic Acknowledge |
| ABS | Acrylonitrile-Butadiene-Styrene (Plastic) |
| AC | All Call |
| AC | Alternating Current |
| ACA | Anisotropically Conductive Adhesive |
| ACC | Advanced Concept Construction Active Control Channel |
| ACCU | Alternating Current Connection Unit |
| AEC | Architecture, Engineering And Construction |
| Agc | Automatic Gain Control |
| AGR | Annual Average Growth Rate |
| AGV | Automated Guided Vehicle |
| AI | Artificial Intelligence |
| AIS | Adhesive Interconnect System |
| ANOVA | Analysis Of Variance |
| ANSI | American National Standards Institute |
| AOI | Automated Optical Inspection |
| AOQ | Average Outgoing Quality |
| APT | Automatically Programmed Tools |
| AQL | Acceptable Quality Level |
| ARINC | Aeronautical Radio Incorporated |
| ASCII | American Standard Code For Information Interchange |
| ASIC | Application Specific Integrated Circuit |
| ASME | American Society Of Mechanical Engineers |
| ASPaRC | Ability Of Solder Paste To Retain Components |
| ASQ | American Society For Quality |
| ASTM | American Society For Testing And Materials |
| ATE | Automatic Test Equipment |
| ATG | Automatic Test Generation |
| ATR | Air Transport Rack |
| AVT | Accelerated Vesication Test |
| AWG | American Wire Gauge |
| AXI | Automated X-Ray Inspection |
| B | |
| BC | Buried Capacitance |
| BDMA | Benzyldimethylamine |
| BGA | Ball Grid Array |
| BITE | Built-In Test Equipment |
| BOD | Biochemical Oxygen Demand |
| BOM | Bill Of Material |
| BTO | Build To Order |
| BT | Bismaleimide Triazine |
| BTAB | Bumped Tape-Automated Bonding |
| C | |
| C&E | Cause And Effect |
| C3 | Command,Control And Communicate |
| C4 | Controlled Collapse Component Connection |
| CAD | Computer-Aided Design |
| CAE | Computer-Aided Engineering |
| CAF | Cathotic Anionic Filaments |
| CAFM | Computer-Aided Facilities Management |
| CAGE | Commercial And Government Entity |
| CALS | Computer-Aided Acquisition And Logistic Support(DOD) |
| CAM | Computer-Aided Manufacturing |
| CAPP | Computer-Aided Process Planning |
| CAR | Computer-Aided Repair |
| CASE | Computer-Aided Software Engineering |
| CAT | Computer-Aided Testing |
| CBGA | Ceramic Ball Grid Array |
| CCAPS | Circuit Card Assembly And Processing System |
| CDA | Copper Development Association |
| CEPM | Certified Ems Program Managers |
| CET | Certified Electronic Technician |
| CFM | Continuous Flow Manufacturing |
| CFM | Cubic Feet Per Minute |
| CIM | Computer-Integrated Manufacturing |
| CISC | Complex Instruction Set Computing |
| CITIS | Contractor Integrated Technical Information Services |
| CM | Contract Manufacturer |
| CMC | Copper Moly Copper |
| CMOS | Complimentary Metal-Oxide Semiconductor |
| CNC | Computer Numerical Control |
| COB | Chip-On-Board |
| COD | Consumed Oxygen Demand |
| COT | Configure To Order |
| Cp | Capability Performance |
| CPL | Capability Performance, Lower |
| CPLD | Complex Programmable Logic Device |
| CPU | Capability Performance, Upper |
| CPU | Central Processing Unit(Computer) |
| CRC | Cyclic Redundancy Check |
| CRT | Cathode-Ray Tube |
| CSA | Canadian Standards Agency |
| CSG | Constructive Solids Geometry |
| CSP | Chip Scale Package |
| CTE | Coefficient Of Thermal Expansion |
| CVS | Cyclic Voltammetry Stripping |
| D | |
| DAB | Designated Audit Body |
| DATC | Design Automation Technical Committee (Ieee) |
| DBMS | Database Management System |
| DC | Direct Current |
| DCAS | Defense Contract Administration Service |
| DCMA | Defense Contract Management Agency |
| DCMC | Defense Contract Management Command |
| DESC | Defense Electronics Supply Center |
| DFM | Design For Manufacture |
| DIM | Data-Information Record |
| DIN | Deutsches Institute For Normung |
| DIP | Dual-Inline Package |
| Dk | Dielectric Constant |
| DLA | Defense Logistics Agency (Dod) |
| DMA | Direct Memory Access |
| DMS | Dynamic Mechanical Spectroscopy |
| DMSA | Defense Manufacturers And Suppliers Association |
| DNC | Distributed (Or Direct) Numerical Control |
| DOD | Department Of Defense |
| DOD | Dissolved Oxygen Demand |
| DOE | Design Of Experiments |
| DOS | Disc Operating System |
| DRC | Design Rule Checking |
| DRM | Drawing Requirements Manual |
| DS | Double-Sided |
| DSC | Differential Scanning Calorimetry |
| DSP | Digital Signal Processor |
| DTP | Diameter True Position |
| DTS | Dock To Stock |
| DVM | Digital Voltmeter |
| DXF | Data Exchange Format |
| E | |
| ECAD | Electronic Computer-Aided Design |
| ECC | Error Correction Code |
| ECCB | Electronic Components Certification Board |
| ECL | Emitter-Coupled Logic |
| ECM | Electronic Countermeasures |
| ECN | Engineering Change Notice |
| ECO | Engineering Change Order |
| ECR | Engineering Change Request |
| ED | Electrodeposited |
| EDA | Electronic Design Automation |
| EDI | Electronic Data Interchange |
| EDIF | Electronic Design Interchange Format |
| EDM | Electro-Discharge Machining |
| EDO | Extended Data Out |
| EIA | Electronics Industry Association |
| EIS | Engineering Information System |
| ELD | Electro-Luminescent Diode |
| EMC | Electromagnetic Compatibility |
| EMF | Electro-Motive Force |
| EMI | Electromagnetic Interference |
| EMP | Electromagnetic Pulse |
| EMPF | Electronics Manufacturing Productivity Facility |
| EMS | Electrical Manufacturing Services |
| EPA | Environmental Protection Agency |
| EPR | Ethylene-Propylene (Copolymer) Resin |
| EPT | Ethylene-Propylene Terepolymer |
| ESD | Electrostatic Discharge |
| ESI | Early Supplier Involvement |
| ESR | Equivalent Series Resistance |
| ETPC | Electrolytic Tough-Pitch Copper |
| F | |
| FAA | Federal Aviation Administration |
| FAR | Failure Analysis Report |
| FCC | Federal Communications Commission |
| FCC | Flat-Conductor Cable |
| FC-CBGA | Flip Chip Ceramic Ball Grid Array |
| FC-PBGA | Flip Chip Platic Ball Grid Array |
| FCT | Functional Circuit Test |
| FEA | Finite-Element Analysis |
| FEM | Finite-Element Modeling |
| FEP | Fluorinated Ethylene-Propylene (Teflon) |
| FET | Field-Effect Transistor |
| FFT | Fast Fourier Transform |
| FMEA | Fault Mode And Effect Analysis |
| FPGA | Field Programmable Gate Array |
| FPT | Fine-Pitch Technology |
| FSCM | Federal Stock Code For Manufacturers |
| FTP | File Transfer Protocol |
| G | |
| GaAs | Gallium Arsenide |
| GBIB | General Purpose Interface Bus |
| GMA | Gas Metal Arc (Welding) |
| GTA | Gas Tungsten Arc (Welding) |
| GTPBGA | Glob Top Plastic Ball Grid Array |
| H | |
| HASL | Hot Air Solder Level |
| HPGL | Hewlett Packard Graphic Language |
| HTE | High Temperature Elongation |
| HTML | Hypertext Markup Language |
| HTTP | Hypertext Transfer Protocol |
| I | |
| I/O | Input/Output (Terminations) |
| IC | Integrated Circuit |
| ICA | Isotropically Conductive Adhesive |
| ICAM | Integrated Computer-Aided Manufacturing |
| ICT | Inner Circuit Test |
| IDC | Insulation-Displacement Connection |
| IEC | International Electrotechnical Commission |
| IECQ | International Electronic Component Qualification System |
| IEDR | Initial Engineering Design Review |
| IEEE | Institute Of Electrical And Electronic Engineers |
| IEPS | International Electronic Packaging Society |
| IGES | Integrated Graphics Exchange System |
| ILB | Inner-Lead Bonding (Tab) |
| IP | Internet Protocol |
| IPM | Inches Per Minute |
| IR | Infrared |
| ISCET | International Society Of Certified Electronics Technician |
| ISHM | International Society For Hybrid Microelectronics |
| ISO | International Organization For Standardization |
| ITT | Inter-Test Time |
| J | |
| JEDEC | Solid State Technology Association (Formerly The Joint Electronic Device Engineering Council) |
| JIT | Just-In-Time (Manufacturing) |
| K | |
| KGB | Known Good Board |
| KGD | Known Good Die |
| L | |
| LAN | Local Area Network |
| LBA | Logical Block Address |
| LCCC | Leadless Ceramic Chip Carrier |
| LCD | Liquid Crystal Display |
| LDA | Logic Design Automation |
| LED | Light-Emitting Diode |
| LGA | Lang Grid Array |
| LIF | Low Insertion Force |
| LMC | Least Material Condition |
| LPISM | Liquid Photo-Imageable Solder Mask |
| LRU | Lowest Replaceable Unit |
| LSI | Large Scale Integration (Integrated Circuit) |
| LTCC | Low Temperature Co-Fired Ceramic |
| M | |
| MA | Mechanical Advantage |
| MAC | Maximum Allowable Concentration |
| MAC | Media Access Control |
| MAP | Manufacturing Automation Protocol |
| MATS | Material Transport Segment |
| MCAD | Mechanical Computer Aided Design |
| MCAE | Mechanical Computer-Aided Engineering |
| MCM | Multichip Module |
| MDA | Methylenedianiline |
| MEK | Methyl-Ethyl Ketone |
| MELF | Metal Electrode Face (Discrete Leadless Component) |
| MIBK | Methyl-Isobutyl Ketone |
| MIR | Moisture Insulation Resistance |
| MITI | Ministry Of International Trade And Industry (Japan) |
| MLB | Multilayer Board |
| MLPWB | Multilayer Printed Wiring Board |
| MMC | Maximum Material Condition |
| MMIC | Monolithic Microwave Integrated Circuit |
| MOS | Metal-Oxide Semiconductor |
| MRP | Material Requirement Planning |
| MRP II | Manufacturing Resource Planning |
| MSDS | Material Safety Data Sheets |
| MSI | Medium Scale Integration (Integrated Circuit) |
| MTBF | Mean Time Between Failures |
| MTTR | Mean Time To Repair |
| N | |
| NADCAP | National Aerospace And Defense Contractors Accreditation Procedures |
| NASA | National Aeronautics And Space Administration |
| NBR | Nitrile Butadiene-Acrylonitrile Rubber |
| NBS | National Bureau Of Standards |
| NC | Numerical Control |
| NDT | Non-Destructive Testing |
| NECQ | National Electronics Component Qualification System |
| NEMA | National Electrical Manufacturers Association |
| NIST | National Institute For Science And Technology |
| NMR | Normal-Mode Rejection |
| NPI | New Product Introduction |
| NSA | National Security Agency |
| O | |
| OA | Organic Acid (Flux) |
| ODR | Oscillating Disk Rheometer |
| OEM | Original Equipment Manufacturer |
| OFHC | Oxygen-Free High-Conductivity Copper |
| OLB | Outer-Lead Bonding (Tab) |
| OSHA | Occupational Safety Hazards Act |
| OSI | Open Systems Interconnection |
| OSP | Organic Solder Preservative |
| P | |
| P&IA | Packaging And Interconnecting Assembly |
| P&IS | Packaging And Interconnecting Structure |
| PBGA | Plastic Ball Grid Array |
| PB | Printed Board |
| PBX | Private Branch Exchange |
| PC | Personal Computer |
| PCA | Printed Circuit Assembly |
| PCB | Printed Circuit Board |
| PCMCIA | Personal Computer Memory Card International Assoc |
| PDES | Product Data Exchange Specification |
| PDL | Page Description Language |
| PEM | Plastic Electronic Module |
| PGA | Pin Grid Array (Leaded Component Package) |
| PHIGS | Programmer’s Hierarchical Interface Graphics Standard |
| PID | Photo-Imageable Dielectric |
| PIP | Pin-In-Paste Technology |
| PLCC | Plastic Leaded Chip Carrier |
| PLD | Programmable Logic Device |
| Pp | Process Performance (See Also Cp) |
| PPM | Parts Per Million |
| PPO | Polyphenylene Oxide |
| PPS | Polyphenylene Sulfide (Plastic) |
| PRT | Planar Resistor Technology |
| PSI | Pounds Per Square Inch |
| PT | Positional Tolerance |
| PTFE | Polytetrafluoroethylene (Teflon) |
| PTH | Plated-Through Hole |
| PVC | Polyvinyl Chloride |
| PVT | Production Validation Test |
| PWA | Printed Wiring Assembly |
| PWB | Printed Wiring Board |
| Q | |
| QFP | Quad Flatpack |
| QML | Qualified Manufacturers List |
| QPL | Qualified Products List |
| QTA | Quick Turn Around |
| R | |
| R | Rosin (Flux) |
| R&R | Repeatability And Reproducibility |
| RA | Rosin Activated (Flux) |
| RAM | Random Access Memory |
| RETMA | Radio Electronics & Television Manufacturers Association |
| RFI | Radio-Frequency Interference |
| RFP | Request For Proposal |
| RFQ | Request For Quote |
| RFS | Regardless Of Feature Size |
| RISC | Reduced Instruction Set Computing |
| RMA | Rosin Mildy Activated (Flux) |
| RMS | Root Mean Square |
| ROM | Read Only Memory |
| ROM | Rough Order Of Magnitude |
| RPM | Revolutions Per Minute |
| RSS | Ramp Soak Spike |
| RTS | Ramp To Spike |
| RTV | Room Temperature Vulcanizing |
| RwoH | Reliability Without Hermeticity |
| S | |
| SAE | Society Of Automotive Engineers |
| SBU | Sequential Buildup |
| SEC | Solvent Extract Conductivity |
| SEM | Scanning Electron Microscope |
| SEM | Standard Electronic Module (Navy) |
| SERA | Sequential Electrochemical Reduction Analysis |
| SFM | Surface Feet Per Minute |
| SIP | Single Inline Package |
| SIR | Surface Insulation Resistance |
| SMD | Surface Mount Device |
| SMEMA | Surface Mount Equipment Manufacturers Association |
| SMOBC | Solder Mask Over Bare Copper |
| SMT | Surface Mounting Technology |
| SMTA | Surface Mount Technology Association |
| SNA | Systems Network Architecture |
| SOIC | Small-Outline Integrated Circuit |
| SOS | Silicon-On-Sapphire |
| SPC | Statistical Process Control |
| SPICE | Simulation Program, Integrated Circuit Emphasis |
| SQC | Statistical Quality Control |
| SQL | Structured Query Language |
| SSI | Small-Scale Integration (Integrated Circuit) |
| STEP | Standard For Exchange Of Product Model Data |
| T | |
| TAB | Tape-Automated Bonding |
| TCE | Thermal Coefficient Of Expansion |
| TCP/IP | Transmission Control Protocol / Internet Protocol |
| TCR | Temperature Coefficient Of Resistance |
| TDR | Time-Domain Reflectometry |
| TEM | Transverse Electromagnetic Mode |
| TFA | Tree-Based Floorplanning Algorithm |
| TFE | Tetrafluoroethylene (Teflon) |
| Tg | Glass Transition Temperature |
| TGA | Thermo Gravimetric Analysis |
| THT | Through-Hole Technology |
| TIFF | Tagged Image File Format |
| TMA | Thermo Mechanical Analysis |
| TO | Transistor Outline |
| TOP | Technical And Office Protocol |
| TP | True Position |
| TQM | Total Quality Management |
| T’s & C’s | Terms And Conditions |
| TTL | Transistor-Transistor Logic |
| U | |
| UBM | Under Bump Metallization |
| UHF | Ultra-High Frequency |
| UL | Underwriter’s Laboratories |
| ULSI | Ultra-Large Scale Integration (Integrated Circuit) |
| UPH | Unit Per Hour |
| URL | Uniform Resource Locator |
| V | |
| VAR | Value-Added Reseller |
| VHDL | Vhsic Hardware Description Language |
| VHF | Very-High Frequency |
| VHSIC | Very-High Speed Integrated Circuits |
| VLSI | Very-Large Scale Integration (Integrated Circuit) |
| VME | Versa-Module Electronic |
| VOC | Volatile Organic Compound |
| VSAG | VHDL Standardization And Analysis Group (IEEE) |
| W | |
| WIP | Work In Process |
| WSI | Wafer-Scale Integration |
| WWW | World Wide Web |
| WYSIWYG | What You See Is What You Get |
| X | |
| XIP | Execute In Place |
| Z | |
| ZAF | Z-Axis Adhesive Film |
| ZIF | Zero-Insertion Force |
| ZIP | Zigzag Inline Package |