Capable of producing the best boards at the highest level.

Hi-Tech offers an extensive broad arrange of electrical, electromechanical, and PCB manufacturing services. These services can include Engineering, PCB assembly, Design for Manufacturability (DFM), Design for Test (DFT), compliance testing, final packaging, and logistics. Innovation and investment in keeping Hi-Tech at the cutting edge helps maintain our position as an industry leader. Our state of the art 33,000 Sq. Ft. electronic assembly facility contains an impressive list of equipment. Our assembly capabilities include:

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      SMT

      ASMPT SX2 with Dual Speedstar Head

      The capabilities of the SIPLACE SpeedStar head provide the SIPLACE SX-Series with raw speed and has become Hi-Tech's chip shooter with placement up to 75,000 CPH per machine to help meet our customer's need for the produc

      Axial Insertion

      Universal Equipment 6241F Axail Inserter

      For single-process sequencing and insertion of axial components and jumper wires, the VCD 6241F delivers reliable productivity at the highest throughput rates in the industry. An error rate of less than 200 ppm is the result of Universal Instruments’ enduring lineage of through-hole development and leadership.

      Radial Insertion

      Universal Equipment 6380 Radial 8XT Inserter

      The Radial 8XT, which can insert up to 21,000 components per
      hour, is an exceptionally high speed (0.17 sec./ins.) Radial Sequencer/
      Inserter.
      The Radial 8XT may be configured either as a Dual Span or a
      Triple Span machine. A Dual Span Radial 8XT inserts 2.5 mm/
      5.0 mm lead span components into printed circuit boards (PC
      boards). A Triple Span Radial 8XT inserts 2.5 mm/5.0 mm/7.5
      mm lead span components into PC boards.

      Tab Insertion

      P-360 Pin and Tab Insertion Machine

      The P-360 is designed and engineered for high-volume production, as well as being able to change-over in under 10 minutes to completely different products. With insertion rates at five per second and options to upgrade to triple simultaneous insertions pushing that number potentially to 15 insertions per second while any rotation within +/-90 degrees not affecting the speed the P-360 is able to quickly and repeatably insert pins and tabs.

      Solder Processing

      KURTZ ERSA HOTFLOW 3/20 Reflow

      With the POWERFLOW system Ersa presents a high-performance wave soldering system with flexible soldering bath technology.

      The upper and lower preheaters are well-insulated to ensures that the boards are completely heated through, even with high-mass assemblies.

      Spray fluxer with intelligent spray pattern programming. Precise spray fluxer with motorized axis drive and 25 l flux tank. Complete reliability when using VOC-free or water-based flux.

      AOI “Automated Optical Inspection”

      Mirtech MV-6 3D AOI

      The ALL NEW MV-6 OMNI 3D In-Line AOI Machine is configured with MIRTEC’s exclusive OMNI-VISION® 3D inspection technology which combines a 15 Mega Pixel CoaXPress Vision System with Digital Multi-Frequency Quad Moiré 3D system. With a 15 Mega Pixel CoaXPress Vision System and Digital Multi-Frequency Quad Moiré Technology provides true 3D inspection using a total of four (4) Programmable Digital Moiré Projectors. This system yields precise height measurement used to detect lifted components and lifted lead defects as well as solder volume post reflow.

      Testing

      FunctionalBurn-in, power up, cycle, etc.
      Flying Probe24 probe, 35″ x 25″max
      RFSynthesized Signal Generator, Frequency Synthesizers, etc.

      Coating

      SCS Conformal Coating System

      The SCS Precisioncoat spray and dispense system precisely applies 100%
      solids, solvent-based and water-based coatings, such as photoresists,
      acrylics, urethanes, epoxies, silicone, adhesives, RTVs, and solder masks,
      to virtually any surface or substrate.

      Washing

      Electrovert Aqua Storm 100 Inline Cleaning System

      The Electrovert Aquastorm 100 is a versatile, high-performance cleaning system designed to optimize the PCB cleaning process. The Aquastorm 100, with its setup design, is ideally suited to RMA and no-clean flux applications that require chemistry, as well as the removal of water-soluble organic acid flux. PCB Warp Correction System

      X-ray

      Glennbrook Jewel Box 70LC x-ray system

      Glennbrook Jewel Box 70T x-ray system

      The JewelBox-70T delivers superior image quality with excellent resolution and sensitivity for laboratory and failure analysis applications. The system’s patented XRTV X-ray camera and Crystal-X imaging plus a 10-micron MicroTech™ x-ray source provide magnification from 7X to 2000X, with resolution of 100 line pairs/mm.

      The ability to manipulate the subject with the five-axis positioner and simultaneously view it from any angle allows the operator to produce accurate images quickly during failure analysis.

      The GTI-5000 Computer Image Processor is designed for the x-ray analysis of surface mount, BGA and PCB components. The software can provide analysis of BGA defects including bridging, voids and missing balls. In addition it can measure drill offset, wire sweep and linear distances. Images can be stored and transmitted as jpg files. Additional features include: frame averaging (for image clarity), manual and automatic contrast adjustment, edge sharpening, colorization and three dimensional syntheses.

      Selective Solder

      ERSA Dual Pot Selective Solder

      Selective Soldering is the process by which conventional leaded components are soldered onto a printed circuit board. It is often necessary to process leaded components that are in very close proximity to surface-mounted parts. Selective Soldering offers the ability to accurately control a nozzle so that parts can be soldered without any damage to the nearest surface mount devices. In some cases, solder points as close as 1mm to the nearest surface mount component, thus offering a highly flexible and cost effective solution.

      Selective Soldering is the process by which conventional leaded components are soldered onto a printed circuit board. It is often necessary to process leaded components that are in very close proximity to surface-mounted parts. Selective Soldering offers the ability to accurately control a nozzle so that parts can be soldered without any damage to the nearest surface mount devices. In some cases, solder points as close as 1mm to the nearest surface mount component, thus offering a highly flexible and cost effective solution.

      Barcoding

      ASYS Laser Bar Code Printer

      INSIGNUM 4000 PCB Laser Marker

      There is a sign off feature on all new revisions and jobs to keep all projects checked by multiple people who have knowledge about the project before going into production protecting quality from an individual’s error.iMaterials in combination with iQ and iTrac will allow Hi-Tech to do a number of things for the quality of our Customers product and allow for the tracking of a product within a few keystrokes. 

      iMaterials will change the material setup by controlling it with barcoding versus an operator manually checking parts off which could result in a human error and running bad product. With the barcode setup, this will also speed up the process which will speed up the overall process. The different areas this can be used for is not only limited to being used for machine verication but any hand station setup. iMaterials will take nearly the entire verication process out of human hands and take it to a barcoding level which in turn will decrease the error opportunity on any of our products tremendously.

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