Capable of producing the best boards at the highest level.
Hi-Tech offers an extensive broad arrange of electrical, electromechanical, and PCB manufacturing services. These services can include Engineering, PCB assembly, Design for Manufacturability (DFM), Design for Test (DFT), compliance testing, final packaging, and logistics. Innovation and investment in keeping Hi-Tech at the cutting edge helps maintain our position as an industry leader. Our state of the art 33,000 Sq. Ft. electronic assembly facility contains an impressive list of equipment. Our assembly capabilities include:
AOI “Automated Optical Inspection”
|Functional||Burn-in, power up, cycle, etc.|
|Flying Probe||24 probe, 35″ x 25″max|
|RF||Synthesized Signal Generator, Frequency Synthesizers, etc.|
Electrovert Aqua Storm 100 Inline Cleaning System
The Electrovert Aquastorm 100 is a versatile, high-performance cleaning system designed to optimize the PCB cleaning process. The Aquastorm 100, with its setup design, is ideally suited to RMA and no-clean flux applications that require chemistry, as well as the removal of water-soluble organic acid flux. PCB Warp Correction System
Glennbrook Jewel Box 70T x-ray system
The JewelBox-70T delivers superior image quality with excellent resolution and sensitivity for laboratory and failure analysis applications. The system’s patented XRTV X-ray camera and Crystal-X imaging plus a 10-micron MicroTech™ x-ray source provide magnification from 7X to 2000X, with resolution of 100 line pairs/mm.
The ability to manipulate the subject with the five-axis positioner and simultaneously view it from any angle allows the operator to produce accurate images quickly during failure analysis.
The GTI-5000 Computer Image Processor is designed for the x-ray analysis of surface mount, BGA and PCB components. The software can provide analysis of BGA defects including bridging, voids and missing balls. In addition it can measure drill offset, wire sweep and linear distances. Images can be stored and transmitted as jpg files. Additional features include: frame averaging (for image clarity), manual and automatic contrast adjustment, edge sharpening, colorization and three dimensional syntheses.
Pillarhouse JADE II Selective Solder
Selective Soldering is the process by which conventional leaded components are soldered onto a printed circuit board. It is often necessary to process leaded components that are in very close proximity to surface-mounted parts. Selective Soldering offers the ability to accurately control a nozzle so that parts can be soldered without any damage to the nearest surface mount devices. In some cases, solder points as close as 1mm to the nearest surface mount component, thus offering a highly flexible and cost effective solution.
There is a sign off feature on all new revisions and jobs to keep all projects checked by multiple people who have knowledge about the project before going into production protecting quality from an individual’s error.iMaterials in combination with iQ and iTrac will allow Hi-Tech to do a number of things for the quality of our Customers product and allow for the tracking of a product within a few keystrokes.
iMaterials will change the material setup by controlling it with barcoding versus an operator manually checking parts off which could result in a human error and running bad product. With the barcode setup, this will also speed up the process which will speed up the overall process. The different areas this can be used for is not only limited to being used for machine verication but any hand station setup. iMaterials will take nearly the entire verication process out of human hands and take it to a barcoding level which in turn will decrease the error opportunity on any of our products tremendously.