Please use the PDF documents below as Solder, Cleaner, & Flux resources.
Water-based stencil cleaner for the removal of solder pastes and SMT adhesives.
A low residue core solder designed for no-clean soldering applications that must meet all appropriate Bellcore specifications.
LPHA Pure Coreis an organic activated, water soluble flux cored solder that at meets the Corrosion Resistance Test and Surface Insulation Resistance requirements forTypeH3C fluxes per IP C-SF-818.
Alpha EF-2210 is VOC-Free, halide-free, rosin/resin-free, low solids no-clean flux which provides the highest activity of any VOC-free Bellcore SIR compliant flux for defect-free soldering.
ALPHA EF-8000 is a rosin-containing flux designed to provide the attributes of excellent solderability and reliability in general and high-density boards in both Lead-Free and eutectic tin/lead processes.
HiFlo solder is manufactured with virgin metals process through Alpha's proprietary viscosity and dross lowering treatments which create the purest, lowest drossing, highest fluidity solder.
ALPHA Vaculoy SACX0307 is a lead-free alloy suitable for use as a replacement for Sn63 alloy in the wave solder process.
Cookson Electronics Assembly Material’s ALPHA OM-5100, is a low residue, no-clean solder paste designed to maximize SMT line yields.
ALPHA OM-338-T is a lead-free, no-clean solder paste designed for a broad range of applications.
ALPHA WS-809 is a SnPb, water-soluble solder paste which is designed for a broad range of SMT processes where aqueous post reflow cleaning is required.
Epibond® epoxy surface mount adhesives are formulated to meet the exacting performance and quality requirements of printed circuit board manufacturers.